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Digi ConnectCore® 6+ 요약정보 및 구매

MODEL : Digi ConnectCore® 6+

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Digi ConnectCore® 6+

쿼드 코어 성능 및 통합 무선 기능을 갖춘 NXP i.MX6Plus 기반의 확장 가능한 표면 실장용 모듈 솔루션

> 확장 가능한 Cortex-A9 멀티 코어 성능

> 독립적인 Cortex-M0 + / Cortex-M4 마이크로 컨트롤러 Assist ™ 서브 시스템

> 비용 효율적이고 안정적인 로우-프로파일 표면 실장 모듈 폼 팩터

> 사전 인증 된 802.11a / b / g / n / ac 및 Bluetooth 5

> PMIC를 통한 스마트 전원 관리 아키텍처

> 안드로이드 및 Yocto 프로젝트 리눅스 소프트웨어 플랫폼 지원

> IEC 60068 및 HALT 검증을 통한 안정적인 설계

>전용 온-모듈 보안 + 인증 컨트롤러

> 장기적인 가용성을 위한 설계

제품 자료 보러가기

Digi ConnectCore 6+는 NXP i.MX6Plus Cortex-A9 프로세서 제품군을 기반으로 하는 초소형 퍼포먼스 시스템 온 모듈 솔루션입니다.

최대 1.2GHz의 프로세서 속도, 완벽하게 핀 호환 가능한 듀얼/쿼드 코어 등을 갖춘 ConnectCore 6+는 확장 가능한 성능과 사전 인증된 무선 802.11a / b / g / n / ac및 BLE(Bluetooth Low Energy)를 포함한 Bluetooth 5 연결이 가능한 진정한 미래 지향적인 플랫폼 솔루션을 제공합니다.

로우 프로파일, 표면 실장 설계는 가장 까다로운 쿼드 코어 시스템 구성에서도 최적화 된 방열 기능으로 비용 효율적이며, 안정적인 폼 팩터에서 통합 유연성을 극대화하고 설계 위험을 크게 줄입니다.

Digi Yocto 리눅스 및 안드로이드 소프트웨어 플랫폼 지원의 일부로 통합된 클라우드는 확장 가능한 Digi Remote Manager®를 통해 안전한 원격 관리 및 웹 서비스 기능을 제공합니다.

DIGI TRUSTFENCE®로 구동되는 안전한 임베디드 디바이스 설계

디바이스의 보안은 모든 장치에 중요한 설계 요소 중 하나입니다. ConnectCore6은 보안 모듈 플랫폼과 완벽한 임베디드 디바이스 보안 소프트웨어 프레임 워크를 결합합니다. 현재와 미래에 안전한 제품 플랫폼을 제공하는 제품을 지금 구축하십시오.

> 관리 장치 보안 소프트웨어 프레임 워크

> U-Boot 및 Linux 플랫폼 통합

> 투명하고 미래를 보장하는 아키텍처

> 제로 구현 효과

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Compare SOMs

	Digi ConnectCore MP1 Intelligent, wireless and secure embedded system-on-module based on the STM32MP1 MPU family, with turnkey Linux support in the robust Digi SMTplus standard form factor	Digi ConnectCore 93 Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8M Mini Embedded system-on-module based on the NXP i.MX 8M Mini processor with built-in Video Processing Unit (VPU); designed for longevity and scalability in industrial IoT applications.	Digi ConnectCore 8M Nano Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications	Digi ConnectCore 6+ NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless	Digi ConnectCore 6UL Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor
	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT
Ethernet	10/100 M or Gigabit Ethernet GMAC IEEE 1588v2, MII/RMII/GMII/RGMII	2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)	10/100/1000M Ethernet + AVB	1x 10/100/1000M Ethernet + AVB	2x 10/100/1000M Ethernet + AVB	10/100/1000 Mbit/s	Dual 10/100 Mbit/s
Graphics	3D GPU (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, parallel LCD-TFT controller, MIPI® DSI 2 data lanes	2D GPU, 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY, 1x 720p 60 LVDS (4-lane), 18-bit parallel RGB	Graphics Processing Unit: GCNanoUltra for 3D acceleration, GC320 for 2D acceleration, LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI, DSI MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface); Video Processing Unit: 1080 p 60 HEVC H.265 (decode), VP9, H.264, VP8 (encode/decode)	GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging	2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)
Operating Temperature	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
Processor Family	ST STM32MP157C, Arm® dual Cortex®-A7 at 650 MHz Cortex®-M4 at 209 MHz with FPU/MPU, 3D GPU, secure boot, crypto engine	NXP® i.MX 93 Up to 2x Cortex®-A55 cores at 1.7 GHz 1x Cortex-M33 core at 250 MHz core for real-time processing	NXP® i.MX 8M Mini Four Cortex®-A53 cores @ 1.6 GHz Cortex-M4 core @ 400 MHz	NXP® i.MX 8M Nano 1-4x Cortex®-A53 cores @ 1.4 GHz 1x Cortex-M7 core @ 600 MHz	NXP® i.MX 8QuadXPlus Up to 4x Cortex®-A35 cores @ 1.2 GHz 1x Cortex-M4F core @ 264 MHz 1x Tensilica® Hi-Fi 4 DSP	NXP® i.MX6 Plus 4x Cortex®-A9 @ 1.2 GHz	NXP i.MX6UL-2 1x Cortex-A7 @ 528 MHz
Wireless	Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with full temperature range; Bluetooth® 5	Wi-Fi 6 802.11ax dual-band 1x1 wireless, Bluetooth® 5.2, 802.15.4	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5
Flash	Up to 1 GB SLC NAND	Up to 32 GB eMMC	Up to 8 GB eMMC	Up to 8 GB eMMC	Up to 64 GB eMMC	Up to 64 GB eMMC	Up to 2 GB NAND (SLC)
RAM	Up to 1 GB DDR3L	Up to 2 GB of LPDDR4 / LPDDR4X	Up to 2 GB LPDDR4	Up to 1 GB of LPDDR4	Up to 4 GB LPDDR4	Up to 2 GB DDR3	Up to 1 GB DDR3
Software Support	Digi Embedded Yocto Linux	Digi Embedded Yocto Linux	Yocto Project Linux, Android	Yocto Project® Linux®	Yocto Project® Linux®, Android™	Yocto Project® Linux®, Android™	Yocto Project® Linux®
Other	Digi Microcontroller Assist™, ultra-low power Arm® Cortex®-M0+	AI/ML Arm Ethos U65 micro neural processor; Digi Microcontroller Assist™ independent Cortex-M0+ microcontroller subsystem supporting ultra-low power modes	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	-	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)	Digi Microcontroller Assist™ (MCA), Secure Element (SE)
Processor Cores	-	-	4	4	Up to 4	Up to 4	1
Processor Architecture	-	-	64-bit	64-Bit	64-Bit	32-Bit	32-Bit
I/O	-	-	USB 2.0 OTG controllers with integrated PHY interfaces, three Ultra Secure Digital Host Controller (uSDHC) interfaces, Gigabit Ethernet controller, four Universal Asynchronous Receiver / Transmitter (UART) modules, four I2C modules, three SPI modules, PCI Express 2.0 (PCIe)	1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules	1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus	1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)
Audio	-	-	5x SAI/I2S, 1x S/PDIF Rx/Tx	5x SAI/I2S, 1x S/PDIF Rx/Tx	4x SAI//I2S, 1x ESAI, 1x S/PDIF Rx/Tx	ESAI, I2S/SSI x3	3x I2S/SAI, 1 x S/PDIF Tx/Rx

· 제품 사양

SPECIFICATIONS	Digi ConnectCore® 6+
APPLICATION PROCESSOR	NXP i.MX6Plus encompasses a quad-core Arm® Cortex®-A9 platform running up to 1.2 GHz with 1 MB of L2 cache, and optimized 64-bit DDR3 or 2-ch., 32-bit LPDDR2 support. Integrated FlexCAN, MLB busses, PCI Express®and SATA-2 provide excellent connectivity
MEMORY	8 GB flash, 2 GB DDR3
PMIC	Dialog DA9063
GRAPHICS	LVDS, MIPI display port, MIPI camera port and HDMI v1.4
SECURITY	RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/INTERFACES	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG
EXTERNAL BUS	26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
ETHERNET	1 Gigabit Ethernet
WI-FI	802.11a/b/g/n/ac
BLUETOOTH	Bluetooth 5
OPERATING TEMPERATURE	-40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE	-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY	5% to 90% (non-condensing)
RADIO APPROVALS	US, Canada, EU, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS- 210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS	LGA-400, 2 mm pitch, fully shielded (heat-spreading)

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